A New High Power IC Surface Mount Package Family: PowerSO-20TM
نویسنده
چکیده
Only a few devices are not yet compatible with SMT principles: a few "exotic" components like large capacitors, resistors, inductors, varistors, etc. and almost all the power semiconductor packages. Several drawbacks are associated with existing power packages: by P. Casati & C. Cognetti A New High Power IC Surface Mount Package Family: PowerSO-20TM & PowerSO-36 Power IC Packaging from Insertion to Surface Mounting
منابع مشابه
A Method to Determine How Much Power a SOT23 Can Dissipate in an Application
With the introduction of smaller surface mount (SMT) packages, it is becoming increasingly important to know their maximum power handling capability in specific applications. The power dissipation capability is directly proportional to size. As the size decreases, the amount of power that the package can dissipate decreases. Also, with the development of new high performance packages such as MS...
متن کاملAN-4178 New High-Voltage SMD Package, Power88 for High- Efficiency, and Low-Profile Power Systems
One of effort to overcome the planar MOSFET’s limit is super-junction technology in high voltage power MOSFET. This technology can dramatically reduce both on-resistance and gate charge, which is usually a trade-off. With smaller parasitic capacitances, the super-junction MOSFETs have extremely fast switching characteristics and therefore reduced switching losses. Naturally fast switching behav...
متن کاملInstrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow
Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during ...
متن کاملTantalum Capacitors in Power Supply Applications
The capacitance range for tantalum capacitors spans from singular microfarads (uFd) through a thousand microfarads. It is an electrolytic type of capacitor that can utilize either a liquid type of electrolyte or a solid state material as the cathode connection. The anode construction utilizes the high porosity of the pressed tantalum material to create an enormous amount of surface area to prod...
متن کاملUsing DMAIC Methodology for MLP Reflow Process Optimization
The widely publicized and studied implementation of lead free solders has led to increased scrutiny on the solder joint formation for surface mount technology electronic components. During the lead free transition packaging technology for power semiconductor components increasingly embraced molded leaded package (MLP) technology. Due to the application demands of power devices, namely temperatu...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
عنوان ژورنال:
دوره شماره
صفحات -
تاریخ انتشار 2001